usb: musb: make davinci and da8xx glues depend on BROKEN

those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.

Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.

For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).

Signed-off-by: Felipe Balbi <balbi@ti.com>

diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig
index 39864e3184a69b17bb0b7367bd929753f6cdd4f8..de0fc884b6da4bcfac3ad15dba4fa5c872284745 100644 (file)
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -34,10 +34,12 @@ choice
 config USB_MUSB_DAVINCI
        tristate "DaVinci"
        depends on ARCH_DAVINCI_DMx
+       depends on BROKEN
 
 config USB_MUSB_DA8XX
        tristate "DA8xx/OMAP-L1x"
        depends on ARCH_DAVINCI_DA8XX
+       depends on BROKEN
 
 config USB_MUSB_TUSB6010
        tristate "TUSB6010"