UPSTREAM: thermal: of-thermal: allow setting trip_temp on hardware

[firefly-linux-kernel-4.4.55.git] / drivers / usb / dwc3 / Kconfig

diff --git a/drivers/usb/dwc3/Kconfig b/drivers/usb/dwc3/Kconfig
index 5a42c459040295a98c286ca993f9468a054682ca..a64ce1c94d6d36901a97cda2a62c536423420eb7 100644 (file)
--- a/drivers/usb/dwc3/Kconfig
+++ b/drivers/usb/dwc3/Kconfig
@@ -87,6 +87,15 @@ config USB_DWC3_KEYSTONE
          Support of USB2/3 functionality in TI Keystone2 platforms.
          Say 'Y' or 'M' here if you have one such device
 
+config USB_DWC3_OF_SIMPLE
+       tristate "Generic OF Simple Glue Layer"
+       depends on OF && COMMON_CLK
+       default USB_DWC3
+       help
+         Support USB2/3 functionality in simple SoC integrations.
+        Currently supports Xilinx and Qualcomm DWC USB3 IP.
+        Say 'Y' or 'M' if you have one such device.
+
 config USB_DWC3_ST
        tristate "STMicroelectronics Platforms"
        depends on ARCH_STI && OF
@@ -96,12 +105,4 @@ config USB_DWC3_ST
          inside (i.e. STiH407).
          Say 'Y' or 'M' if you have one such device.
 
-config USB_DWC3_QCOM
-       tristate "Qualcomm Platforms"
-       depends on ARCH_QCOM || COMPILE_TEST
-       default USB_DWC3
-       help
-         Recent Qualcomm SoCs ship with one DesignWare Core USB3 IP inside,
-         say 'Y' or 'M' if you have one such device.
-
 endif