Support of USB2/3 functionality in TI Keystone2 platforms.
Say 'Y' or 'M' here if you have one such device
+config USB_DWC3_OF_SIMPLE
+ tristate "Generic OF Simple Glue Layer"
+ depends on OF && COMMON_CLK
+ default USB_DWC3
+ help
+ Support USB2/3 functionality in simple SoC integrations.
+ Currently supports Xilinx and Qualcomm DWC USB3 IP.
+ Say 'Y' or 'M' if you have one such device.
+
config USB_DWC3_ST
tristate "STMicroelectronics Platforms"
depends on ARCH_STI && OF
inside (i.e. STiH407).
Say 'Y' or 'M' if you have one such device.
-config USB_DWC3_QCOM
- tristate "Qualcomm Platforms"
- depends on ARCH_QCOM || COMPILE_TEST
- default USB_DWC3
- help
- Recent Qualcomm SoCs ship with one DesignWare Core USB3 IP inside,
- say 'Y' or 'M' if you have one such device.
-
endif