-W83627DHG, W83627DHG-P, W83667HG and W83667HG-B super I/O chips.
-We will refer to them collectively as Winbond chips.
-
-The chips implement three temperature sensors, five fan rotation
-speed sensors, ten analog voltage sensors (only nine for the 627DHG), one
-VID (6 pins for the 627EHF/EHG, 8 pins for the 627DHG and 667HG), alarms
-with beep warnings (control unimplemented), and some automatic fan
-regulation strategies (plus manual fan control mode).
+W83627DHG, W83627DHG-P, W83667HG, W83667HG-B, W83667HG-I (NCT6775F),
+and NCT6776F super I/O chips. We will refer to them collectively as
+Winbond chips.
+
+The chips implement three temperature sensors (up to four for 667HG-B, and nine
+for NCT6775F and NCT6776F), five fan rotation speed sensors, ten analog voltage
+sensors (only nine for the 627DHG), one VID (6 pins for the 627EHF/EHG, 8 pins
+for the 627DHG and 667HG), alarms with beep warnings (control unimplemented),
+and some automatic fan regulation strategies (plus manual fan control mode).
+
+The temperature sensor sources on W82677HG-B, NCT6775F, and NCT6776F are
+configurable. temp4 and higher attributes are only reported if its temperature
+source differs from the temperature sources of the already reported temperature
+sensors. The configured source for each of the temperature sensors is provided
+in tempX_label.